Wafer coatings

Wafer with structured coatings.

Wafer with AuSi coating

We do coating of wafers for semiconductor industry under clean room conditions (ISO 5).

The coatings are single or double sided and can consist of single or multiple layers.

A wide variety of metals like Au, Ag, Pt, Ir, Ni, Cu, Ti, Ta, W, Co, Al, Hf or others can be done by DC magnetron sputtering. All their reactive products of Nitrogen and Oxygen can be produced by reactive sputtering.

Diameters up to 12” and thicknesses from 10 nm up to 10 μm are possible.

Also structuring in the mm-range is an option we offer.

The coated wafers, made from different substrates, can be ordered from our partners.

Example: 60 nm copper coating measured by XRR
ISO 5 clean room